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美国原装进口PACE Technologies 精密圆盘锯片（4英寸）
Metallographic Wafering Blades WB-0040LC、WB-0045LC、WB-0045HC
4-inch Diameter (102 mm) Wafering Blade, 1/2 inch (12.7 mm) Arbor x 0.012 inch thick
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Application/ Description |
Cat. No. |
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Brittle materials
(microelectronics, friable ceramics, minerals)
Low concentration/fine grit diamond |
WB-0040LC |
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Hard tougher ceramics
(silicon nitride, zirconia)
Low concentration/ medium grit diamond |
WB-0045LC |
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Most metal samples
High concentration/ medium grit diamond |
WB-0045HC |
PACE Technologies U.S.A. |
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